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DATA ITEM DESCRIPTION
Title: ELECTROMAGNETIC ENVIRONMENTAL EFFECTS (E3) VERIFICATION
REPORT (E3VR)
Number: DI-EMCS-81542A Approval Date: 20021219
AMSC Number: F7488 Limitation:
DTIC Applicable: No GIDEP Applicable: No
Office of Primary Responsibility: 11
Applicable Forms:
Use/relationship: The E3VR describes the tests, analyses, and inspections used by the
contractor and documents the results verifying compliance with the E3 interface and
performance requirements of a system. The E3VR provides the means for the government to
evaluate E3 verification results.
a. This DID contains the format and content preparation instructions for data resulting from the
work task described by 4.1 of MIL-STD-464 and is intended for airborne, sea, space, and ground
systems, including associated ordnance. It is normally applied to the System Design and
Development phase of a program, but it can be used in any phase.
d. This DID is related to DI-EMCS-81540A and DI-EMCS-81541A.
Requirements:
1. Reference documents: The applicable issue of the documents cited herein, including their
approval dates and dates of any applicable amendments, notices, or revisions, shall be as cited in
the solicitation or contract.
2. Format. The E3VR shall be in contractor format.
3. Content. The E3VR shall describe the overall verification results (test, analysis, and
inspection, as applicable) for each E3 requirement specified in the contract for the system being
developed.
3.1 Summary information. The report shall summarize the following:
3.1.1 Introduction, background.
a. System description, including any pertinent information regarding verification issues.
b. Statement of any assumptions and limitations associated with verification efforts.
3.1.2 Body. A general description of the results shall be provided for the verification of each E3
interface and performance requirement area listed in section 3.2.
a. Synopsis of verification procedure and reference to detailed procedures.
b. Successes and failures.
c. Impacts of failures on operational performance.
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