NOT MEASUREMENT
SENSITIVE
MIL–PRF–31032B
SUPPLEMENT 1
31 January 2010
PERFORMANCE SPECIFICATION
PRINTED CIRCUIT BOARD/PRINTED WIRING BOARD,
GENERAL SPECIFICATION FOR
This supplement forms a part of MIL–PRF–31032, dated 31 January 2010.
SPECIFICATION SHEETS
MIL–PRF–31032/1 – Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, With or
Without Blind and Buried Plated Through Holes, for Soldered Part Mounting.
MIL–PRF–31032/2 – Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base
Material, With or Without Plated Through Holes, for Soldered Part Mounting.
MIL–PRF–31032/3 – Printed Wiring Board, Flexible, Single and Double Layer, With or Without Plated Through
Holes, With or Without Stiffeners, for Soldered Part Mounting.
MIL–PRF–31032/4 – Printed Wiring Board, Rigid Flex or Flexible, Multilayer, With Plated Holes, With or Without
Stiffeners, for Soldered Part Mounting.
MIL–PRF–31032/5 – Printed Wiring Board, Rigid, Multilayered, Thermoplastic or Thermoplastic and
Thermosetting Resin Base Material, With Plated Through Holes, for High Frequency
Applications.
MIL–PRF–31032/6 – Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material,
With or Without Plated Through Holes, for High Frequency Applications.
Custodians: Preparing activity:
Army – CR DLA – CC
Navy – EC
Air Force – 85 (Project 5998–2009–045)
DLA – CC
Review activities:
Army – MI
Navy – MC
Air Force – 99
NOTE: The activities listed above were interested in this document as of the date of this document. Since
organizations and responsibilities can change, you should verify the currency of the information above using the
ASSIST Online database at https://assist.daps.dla.mil/.
AMSC N/A FSC 5998
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