MIL F 14256F(修正1)助焊剂焊接液浆助焊剂焊膏和焊膏助焊剂(用于电子电气)

ID:51942

大小:0.16 MB

页数:10页

时间:2023-03-23

金币:20

上传者:战必胜
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AMSC NIA
DISTRIBUTION STATEMENT A,
MIL-F-14256F
Amendment 1
18 May 1994
MILITARY SPECIFICATION
FLUX, SOLDERING, LIQUID, PASTE FLUX,
SOLDER PASTE AND SOLDER-PASTE FLUX,
(FOR ELECTRONIC/ELECTRf CAL USE)
GENERAL SPECIFICATION FOR
This amendment forms a part of MlL-F- 14256F, dated 26 April 1993,
and is approved for use by all Departments and Agencies of the
Department of Defense.
PAGE 5
3.2.1.3, delete and substitute:
“3.2. 1.3 Tvoe LR. Flux manufacturers may classify certain formulations of nonrosin-
based, rosin-based or water soluble fluxes as low residue (LR) fluxes for use in manufacturing
processes which minimize or eliminate cleaning operations. Type LR fluxes shall be free of
ionic and non-ionic halide(s) arsd/or halogen(s). During qualification, fluxes classified as low
residue shall be tested for surface insulation resistance, both after cleaning and without
cleaning. The results of both tests shall be reported separately in the qualification report. [n
the material data sheet, manufacturers of low residue fluxes shall provide recommendations on
whether the flux should be cleaned. In addition, the material data sheet should describe known
material incompatibility with commonly used solvents, saponifies, and other cleaning
materials.
3.2.3, delete and substitute title as follows:
“3.2.3 Resistivitv of water extract (ao~licable to Tv
oes R. RMA. RA. WSF-O and
pglof5
FSC 3439
Approved for public relwse; distribution is unlimited.
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