红外测温仪在磨削表面温度测量中的应用

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Citation: Ito, Y.; Kita, Y.; Fukuhara, Y.;
Nomura, M.; Sasahara, H.
Development of In-Process
Temperature Measurement of
Grinding Surface with an Infrared
Thermometer. J. Manuf. Mater.
Process. 2022, 6, 44. https://doi.org/
10.3390/jmmp6020044
Academic Editors: Arkadiusz Gola,
Izabela Nielsen and Patrik Grznár
Received: 3 March 2022
Accepted: 6 April 2022
Published: 8 April 2022
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4.0/).
Manufacturing and
Materials Processing
Journal of
Article
Development of In-Process Temperature Measurement of
Grinding Surface with an Infrared Thermometer
Yukio Ito *, Yoshiyuki Kita, Yoshiya Fukuhara, Mamoru Nomura and Hiroyuki Sasahara
Department of Mechanical Systems Engineering, Tokyo University of Agriculture and Technology,
Tokyo 184-8588, Japan; yoshiyukikt41@gmail.com (Y.K.); josiah@mh1.117.ne.jp (Y.F.);
mamoru.nomura@ibarakiseito.com (M.N.); sasahara@cc.tuat.ac.jp (H.S.)
* Correspondence: jms007@me.ccnw.ne.jp; Tel.: +81-42-388-7417
Abstract:
Heat generation is a critical issue in grinding. If the grinding point generates significant
heat, dimensional and shape accuracy may decrease due to thermal deformation, and the machined
surface may deteriorate due to grinding burn. Therefore, monitoring the temperature during grinding
is important to obtain ideal machining results. In this research, we develop a new method to measure
the grinding surface and grinding wheel surface temperature during in-process machining. The
proposed method measures the temperature of the grinding surface through small holes in a rotating
grinding wheel. Using this method, we measured the temperature of the grinding surface during
the dry grinding of carbon fiber reinforced plastics (CFRP). Temperature of the grinding surface
was measured every 1/4 rotation of the grinding wheel at any depth of cut, assuming precision
grinding, rough grinding, and high-efficiency grinding. The measurement value changed depending
on the temperature measurement position of the infrared thermometer from numerical analysis of
the grinding surface temperature. We also found that when the cut depth was small, the temperature,
including the surface of the workpiece before machining, was measured at a specific temperature
measurement position. The newly developed temperature measurement method was capable of
in-process measurement of the grinding surface temperature and of detecting temperature rise when
the grinding wheel was clogged.
Keywords:
grinding; temperature measurement; in-process monitoring; CFRP; infrared thermometer
1. Introduction
Grinding is employed for a wide range of finishing processes because it can eas-
ily achieve higher dimensional accuracy and fine surface roughness for high-hardness
materials. However, the grinding wheel surface changes during the process due to the
self-sharpening effect, in which the wear and drop off of the abrasive grains occur appro-
priately. Even in an electroplated grinding wheel, the state of the grinding surface changes
due to wear and clogging of the abrasives. The setting and management of the grinding
conditions largely depend on the skill of workers. In addition, it should be noted that
a large amount of heat generated during grinding tends to lead to the deterioration of
dimensional and shape accuracy due to thermal deformation and grinding burn, which
can change the material properties of the work material.
Grinding burns sometimes cannot be detected from appearance only after grinding,
and management during the process is important [
1
]. Grinding is effective not only for
metallic materials but also for fiber-reinforced composites, such as carbon fiber reinforced
plastics (CFRP). If the temperature exceeds the glass transition point, however, the deterio-
ration of the mechanical properties of materials can be expected. It is therefore necessary to
know the grinding point temperature.
In recent years, the manufacturing phase has shifted from an era that relied on hard-
ware technology to one that manufactures fabricated products at low cost with a short lead
J. Manuf. Mater. Process. 2022, 6, 44. https://doi.org/10.3390/jmmp6020044 https://www.mdpi.com/journal/jmmp
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