MIL-PRF-19500M
22 October 1999
SUPERSEDING
MIL-PRF-19500L
22 October 1998
PERFORMANCE SPECIFICATION
SEMICONDUCTOR DEVICES,
GENERAL SPECIFICATION FOR
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
1. SCOPE
1.1 Scope. This specification establishes the general performance requirements for semiconductor devices. Detail requirements
and characteristics are specified in the performance specification sheet. Revisions to this and performance specification sheets are
structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance
inspection (CI) completion date. Five quality levels for encapsulated devices are provided for in this specification, differentiated by
the prefixes JAN, JANTX, JANTXV, JANJ, and JANS. Seven radiation hardness assurance (RHA) levels are provided for the
JANTXV and JANS quality levels. These are designated by the letters M, D, L, R, F, G, and H following the quality level portion of
the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC
and JANKC.
1.2 Description. This specification contains the performance requirement and verification methods for semiconductor devices.
The main body specifies the performance requirements and requires the manufacturer to verify that their devices are capable of
meeting those performance requirements. Appendix A contains definitions of terms used throughout the specification. Appendix B
contains abbreviations and symbols. Appendix C contains the Quality Management (QM) Program. Appendix D contains the
quality system. Appendix E contains the standard verification system for qualified products. Appendix F contains the Radiation
Tolerant Source of Supply Program for semiconductor devices. Appendix G contains the standard verification flow for
unencapsulated devices. Appendix H contains critical interface and materials for semiconductor devices.
1.3 Identification. The part numbering schemes are as follows:
a. The Part or Identifying Number (PIN) for encapsulated semiconductor devices furnished under this specification is
formulated as follows:
JANQQQ A XN YYYY ZZZ
JAN brand and
quality level
(see 1.3.1)
RHA designator
(see 1.3.4)
Component
designation
(see 1.3.5)
Identification
number
(see 1.3.6)
Suffix
letters
(see 1.3.7)
b. The PIN for unencapsulated semiconductor devices furnished under this specification is formulated as follows:
JANQCW A XN YYYY ZZ
JAN brand
quality level and
identifiers
(see 1.3.2 and 1.3.3)
RHA designator
(see 1.3.4)
Component
designation
(see 1.3.5)
Identification
number
(see 1.3.6)
Suffix
letters
(see 1.3.7)
AMSC N/A FSC 5961
DISTRIBUTION STATEMENT A. Approved for public release, distribution is unlimited.
INCH-POUNDThe documentation and process
conversion measures necessary to
comply with this revision must
be completed by 22 December 1999
Beneficial comments (recommendation, additions, deletions) and any pertinent data which may be of use in improving this
document should be addressed to: Defense Supply Center Columbus, ATTN: DSCC/VAC, P.O. Box 3990, Columbus OH 45316-
5000, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by
letter.
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