PERFORMANCE SPECIFICATION SHEET
PRINTED WIRING BOARD, RIGID, MULTILAYERED,
THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND
BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist
of this specification sheet and MIL–PRF–31032.
1. SCOPE
1.1 Scope. This specification covers the generic performance requirements for rigid, multilayered (three or more
conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, that will use soldering
for component/part mounting (see
6.1.1).
1.2 Classification. Printed boards are of classified by 1.2.1 and 1.2.2, as specified (see 6.2).
1.2.1 Printed board type. Printed boards covered by this specification sheet are of the following types:
3 – Rigid multilayer board without blind or buried vias.
4 – Rigid multilayer board with blind and/or buried vias.
1.2.2 Wrap copper plating grade. The wrap copper plating grade designation is defined by the amount of
plated-through hole surface and knee continuous copper plating thickness remaining after surface processing. The
grades are as follows:
A – Printed boards of this grade have 80 percent or more of the specified plated-through hole wrap
copper plating thickness on the surface and knee after surface processing.
B – Printed boards of this grade have 50 percent or more of the specified plated-through hole wrap
copper plating thickness on the surface and knee after surface processing.
C – Printed boards of this grade have 20 percent or more of the specified plated-through hole wrap
copper plating thickness on the surface and knee after surface processing.
Unless otherwise specified, the default grade of wrap copper plating is grade A for printed board designs that will not
undergo planarization and grade B for designs that require planarization.
Comments, suggestions, or questions on this document should be addressed to Defense Supply Center,
Columbus, ATTN: DSCC–VAC, P.O. Box 3990, Columbus, OH 43218–3990, or emailed to
5998.Documents@dla.mil
. Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at https://assist.daps.dla.mil/.
AMSC N/A FSC 5998
The document and process conversion
measures necessary to comply with
this revision shall be completed by
MIL–PRF–31032/1C
23 May 2010
SUPERSEDING
MIL–PRF–31032/1B
4 July 2009
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