PERFORMANCE SPECIFICATION SHEET
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER,
THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT
PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist
of this specification sheet and MIL–PRF–31032.
1. SCOPE
1.1 Scope. This specification covers the generic performance requirements for rigid, single and double sided (1 or
2 conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes that will
use soldering for component/part mounting (see
6.1.1).
1.2 Classification. Printed boards are classified as rigid, type 1 (single sided), or type 2 (double sided), as
specified (see
6.2).
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this
specification, whether or not they are listed.
2.2 Government documents. The following specification forms a part of this document to the extent specified
herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL–PRF–31032 – Printed Circuit Board/Printed Wiring Board, General Specification for.
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or
https://assist.daps.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111–5094.)
Comments, suggestions, or questions on this document should be addressed to Defense Supply Center,
Columbus, ATTN: DSCC–VAC, P.O. Box 3990, Columbus, OH 43218–3990, or emailed to
5998.Documents@dla.mil. Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at https://assist.daps.dla.mil/.
AMSC N/A FSC 5998
14 June 2010
SUPERSEDING
MIL–PRF–31032/2A
The document and process conversion
measures necessary to comply with
this revision shall be completed by
11 December 2010.
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