METRIC
MIL-PRF-31032/5
w/AMENDMENT 1
10 March 2009
SUPERSEDING
MIL-PRF-31032/5
20 August 2007
PERFORMANCE SPECIFICATION SHEET
PRINTED WIRING BOARD, RIGID, MULTILAYERED,
THERMOPLASTIC OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL,
WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist
of this specification sheet and
MIL-PRF-31032.
1. SCOPE
1.1 Scope
. This specification covers the generic performance requirements for rigid, multilayered (three or more
conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, constructed of
thermoplastic base materials, that will use soldering for component/part mounting (see 6.1.1). Mixed base material
printed boards containing both thermoplastic and thermosetting resin base materials are also cov
ered. The printed
board may contain an internal metal core or external heat sink.
1.2 Classification
. Printed boards covered by this specification sheet are classified by the following types and
compositions, as specified (see 3.1).
1.2.1 Printed board ty
pe
. Printed boards covered by this specification sheet are classified by the following types:
3 – Rigid multilayer board without blind or buried vias.
4 – Rigid multilayer board with blind and/or buried vias.
5 – Rigid multilayer board without blind and/or buried vias, with metal core or metal backing external
heatsink.
6 – Rigid multilayer with blind and/or buried vias, with metal core or metal backing external heatsink.
1.2.2 Composition
. The composition designation is defined by the resin system of the dielectric base material
(see 6.7) as follows:
H
– Homogenous base material printed boards. Printed board of this composition contain only
thermoplastic resin base materials (see 6.7.1).
M
– Mixed based material printed boards. Printed boards of this composition contain layers of
thermoplastic and thermosetting resin base materials (see 6.7.2).
C
omments, suggestions, or questions on this document should be addressed to: Defense Supply Center,
Columbus, ATTN: DSCC/VAC, P. O. Box 3990, Columbus, OH 43218-3990 or emailed to
5998.Documents@dla.mil. Since contact information can change, you may
want to verify the currency of this
address information using the ASSIST Online database at http://assist.daps.dla.mil/.
AMSC N/A FSC 5998
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