METRIC
MIL-PRF-31032/6
w/AMENDMENT 1
10 April 2009
SUPERSEDING
MIL-PRF-31032/6
11 March 2008
PERFORMANCE SPECIFICATION SHEET
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED,
THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT
PLATED–THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist
of this specification sheet and
MIL-PRF-31032.
1. SCOPE
1.1 Scope
. This specification covers the generic performance requirements for single and double sided (one or
two conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes,
constructed of thermoplastic base materials, that will use soldering for component/part mounting (see 6.1). The
printed board may
contain an external heat sink.
1.2 Classification
. Printed boards covered by this specification sheet are classified by the following types and
compositions, as specified (see 3.1).
1.2.1 Printed board type
. Printed boards covered by this specification sheet are classified by the following types:
Type 1 – Rigid single sided.
Type 2 – Rigid double sided.
1.2.2 Composition
. The composition designation is defined by the resin system of the dielectric base material (see
6.5) as follows:
H
– Homogenous base material printed boards. Printed board of this composition contain only
thermoplastic resin base materials (see 6.5.1).
B
– Metal backed printed boards. Printed boards of this composition contain a heavy layer of metal as
specified (see 6.5.2).
Comments, suggestions, or questions on this document should be addressed to: Defense Supply
Center,
Columbus, ATTN: DSCC/VAC, P. O. Box 3990, Columbus, OH 43218–3990 or emailed to
5998.Documents@dla.mil. Since contact information can change, you may w
ant to verify the currency of this
address information using the ASSIST Online database at http://assist.daps.dla.mil/.
AMSC N/A FSC 5998
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